cms05 2013-11-01 1 toshiba schottky barrier rectifier schottky barrier type cms05 switching mode power supply applications portable equipment battery applications ? forward voltage: v fm = 0.45 v (max) ? average forward current: i f (av) = 5.0 a ? repetitive peak reverse voltage: v rrm = 30 v ? suitable for compact assembly due to small surface-mount package ?m ? flat tm ? (toshiba package name) absolute maximum ratings (ta = 25c) characteristics symbol rating unit repetitive peak reverse voltage v rrm 30 v average forward current i f (av) 5.0 (note 1) a peak one cycle surge forward current (non-repetitive) i fsm 70 (50 hz) a junction temperature t j ?40~150 c storage temperature t stg ?40~150 c note 1: t ? = 100c: rectangular waveform ( = 180), v r = 15 v note 2: using continuously under h eavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability signific antly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/derating concept and methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit v fm (1) i fm = 1.0 a ? 0.35 ? v fm (2) i fm = 3.0 a ? 0.40 ? peak forward voltage v fm (3) i fm = 5.0 a ? 0.43 0.45 v i rrm v rrm = 5.0 v ? 6.0 ? repetitive peak reverse current i rrm v rrm = 30 v ? 65 800 a junction capacitance c j v r = 10 v, f = 1.0 mhz ? 330 ? pf device mounted on a ceramic board (soldering land: 2 mm 2 mm) ? ? 60 r th (j-a) device mounted on a glass-epoxy board (soldering land: 6 mm 6 mm) ? ? 135 thermal resistance r th (j- ? ) ? ? ? 16 c/w unit: mm jedec D jeita D toshiba 3-4e1a weight: 0.023 g (typ.) start of commercial production 2000-07
cms05 2013-11-01 2 marking abbreviation code part no. s5 cms05 standard soldering pad handling precaution schottky barrier diodes have reverse current characteristics compared to other diodes. there is a possibility sbd may cause ther mal runaway when it is used under high temperature or high voltage. please take forward and reverse loss into consideration during design. the absolute maximum ratings denote the absolute maximu m ratings, which are rated values and must not be exceeded during operation, even for an instant. the following are the genera l derating methods that we recommend when you design a circuit with a device. v rrm : use this rating with reference to the above. v rrm has a temperature coefficient of 0.1%/c. take this temperature coefficient into account designing a device at low temperature. i f(av) : we recommend that the worst case current be no greater than 80% of the absolute maximum rating of i f(av) and t j be below 120c. when using this device, take the margin into consideration by using an allowable tamax-i f(av) curve. i fsm : this rating specifies the non-repetitive peak curren t. this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. t j : derate this rating when using a device in order to ensure high reliability. we recommend that the device be used at a t j of below 120c. thermal resistance between junction and ambient fluctuat es depending on the device?s mounting condition. when using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. please refer to the rectifiers databook for further information. 3.0 1.4 2.1 unit: mm 1.4
cms05 2013-11-01 3 0.5 0.001 0.01 0.1 1 10 100 1000 1 10 100 500 device mounted on a glass-epoxy board soldering land: 2.1 mm 1.4 mm device mounted on a glass-epoxy board soldering land: 6.0 mm 6.0 mm device mounted on a ceramic board soldering land: 2.0 mm 2.0 mm transient thermal impedance r th (j-a) (c/w) maximum allowable lead temperature t ? max (c) instantaneous forward voltage v f (v) i f ? v f instantaneous forward current i f (a) average forward current i f (av) (a) p f (av) ? i f (av) average forward power dissipation p f (av) (w) average forward current i f (av) (a) maximum allowable ambinent temperature ta m a x ( c ) average forward current i f (av) (a) t ? max ? i f (av) time t (s) r th (j-a) ? t 0.1 0 0.2 1 10 0.4 0.6 0.8 1.0 1.2 100 t j = 150c 75c 25c 125c 0 2 0 0.4 0.8 1.2 1.6 3.2 2.4 2.8 2 4 6 8 10 = 60 = 120 = 180 dc 360 0 rectangular waveform conduction angle: 1 0 2 3 5 6 160 60 0 20 40 80 100 4 7 8 120 = 60 = 120 = 180 dc 140 conduction angle: v r = 15 v 360 0 rectangular waveform i f (av) t a max ? i f (av) device mounted on a ceramic board ( board size: 50 mm 50 mm ) 1 0 2 3 5 6 160 60 0 20 40 80 100 4 7 8 120 rectangular waveform 360 0 conduction angle: v r = 15 v i f (av) 140 = 60 180 dc 120
cms05 2013-11-01 4 v r = 30 v 5 v 10 v 15 v 20 v pulse test 0.001 0 160 80 20 40 60 100 120 140 0.01 0.1 1 10 100 1000 reverse current i r (ma) junction capacitance cj (pf) number of cycles surge forward current (non-repetitive) peak surge forward current i fsm (a) reverse voltage vr (v) c j ?v r (typ.) junction temperature t j (c) i r ? t j (typ.) reverse voltage v r (v) p r (av) ? v r (typ.) average reverse power dissipation p r (av) (w) 0 1 10 100 20 40 60 80 f = 50 hz ta = 25c 30 1 10 50 100 1000 5 3 30 300 500 50 f = 1 mhz ta = 25c 1 2 3 4 5 0 0 10 20 30 = 60 120 dc rectangular waveform conduction angle: t j = 150c 360 0 v r 180 240 300
cms05 2013-11-01 5 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability wh atsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the applicable export laws and regulations including, without limitat ion, the japanese foreign exchange and foreign trade law and t he u.s. export administration regulations. export and re-export of pr oduct or related software or technology are strictly prohibit ed except in compliance with all appl icable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.
|
